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Both Fujitsu’s 45-nanometer and TSMC’s (Taiwan Semiconductor Manufacturing Company) 40-nanometer manufacturing processes are tipped as possible routes VIA will take for the dual-core chip. It’s unclear whether, like the single-core Nano 3000, the dual-core processor will be pin-for-pin compatible with earlier Nano motherboards, or if it will require a new design.
One expected feature to be added to the new chips is SSE4 instruction support. SSE4 (Streaming SIMD Extensions 4) instructions can be used to speed up multimedia applications, potentially giving VIA’s processors an edge over Intel’s Atom CPU in the hotly contested netbook and nettop segment.
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BY Chris Davies
Source:SLASHGEAR
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